What are the commonalities between stacked inductors and wound chip inductors?
1. Functional commonality: They jointly possess functions such as inductor energy storage, filtering, and choking.
2. Common mounting method: Belonging to the same type of chip inductance, suitable for surface mounting.
3. The basic composition materials are the same: the core structure is still composed of wire coils wound around the magnetic core.
4. Other common points: both have good reliability and heat resistance, suitable for general welding and reflow soldering
We have already understood the similarities between stacked inductors and wound chip inductors, and now let's talk about their differences.
What is the difference between stacked inductors and wound chip inductors

Differences in production processes:
The wound chip inductor is based on the traditional production process of wound inductor, which transforms the traditional plug-in inductor into a chip packaging, while reducing the volume of the inductor and making installation more convenient; The SMD laminated inductor is made using multi-layer printing technology and laminated production process.

Structural differences:
The most obvious difference is that the stacked inductors all contain a magnetic shielding structure, so the wires cannot be directly seen. Generally, the volume is smaller than that of the wound chip inductors, which is more space saving; The winding chip inductor has a magnetic shielding structure, while some do not (as shown in Figure 1: some wires of winding inductors are directly visible). In comparison, the magnetic shielding structure makes stacked inductors less susceptible to electromagnetic interference than wound inductors, and has less impact on surrounding components. The smaller size also facilitates the miniaturization of electronic products and the centralized installation of inductors.

Differences in inductance performance:
SMD laminated inductors have good magnetic shielding, high sintering density, and good mechanical strength, but their inductance accuracy and inductance range are not as good as those of wound SMD inductors. In addition, wound chip inductors have advantages such as high Q value, low losses, and high current flow.

Differences in inductance prices:
Due to the differences in structure and process between stacked and wound inductors, the production of stacked inductors is more difficult and requires higher technical requirements, resulting in more defects, higher production costs, and higher prices than wound inductors.

Other differences:
The heat dissipation of stacked inductors is better than that of wound chip inductors

Summary:
There are four common aspects between stacked inductors and wound chip inductors, but there are differences in inductance production process, structure, performance, and price. In summary, patch wound inductors cannot see the wires, and have better resistance to inductance interference, heat dissipation, and installation space saving compared to patch wound inductors. However, wound inductors are slightly better in terms of current resistance and inductance production costs, and the ESR value of wound inductors is higher than that of patch wound inductors.